(PR) HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models

30.10.2024 в 12:26,
Hard news

TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding. Major HBM manufacturers are conside

ring whether to adopt hybrid bonding for HBM4 16hi stack products but have confirmed plans to implement this technology in the HBM5 20hi stack generation. Hybrid bonding offers several advantages whe ...

Автор: TheLostSwede
Источник: https://www.techpowerup.com/328268/hbm5-20hi-stack-to-adopt-hybrid-bonding-technology-potentially-transforming-business-models
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