Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company's current facilities in Singapore. Micron marked the oc
casion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, Pee Beng ...
Автор: TheLostSwede
Источник: https://www.techpowerup.com/330753/micron-breaks-ground-on-new-hbm-advanced-packaging-facility-in-singapore