Micron Ships HBM4 Samples: 12-Hi 36 GB Modules with 2 TB/s Bandwidth

Micron has achieved a significant advancement of the HBM4 architecture, which will stack 12 DRAM dies (12-Hi) to provide 36 GB of capacity per package. According to company representatives, initial en

gineering samples are scheduled to ship to key partners in the coming weeks, paving the way for full production in early 2026. The HBM4 design relies on Micron's established 1β ("one-beta")  ...