AMD will transition its next-generation "Zen 6" desktop Ryzen and server EPYC processors to a split-node strategy, placing CPU core complex die (CCD) on TSMC N2P 2 nm node variant and buildi
ng the I/O die (IOD) on the N3P 3 nm node. At TSMC, volume ramp for the 2 nm node is around the third quarter of 2026, opening the door for limited shipments as early as late Q3 or broader availabilit ...
Автор: AleksandarK
Источник: https://www.techpowerup.com/340627/amd-zen-6-processors-to-use-tsmc-2-nm-node-for-ccds-3-nm-for-iod