During its investors day yesterday, Micron revealed its 232-layer NAND Flash, which for now is the most advanced of its kind. Micron is using what the company calls CMOS Under Array or CuA as the plat
form to build a pair of TLC stacks on top of, for a total of 232-layers. Each stacked NAND Flash chip is said to have a capacity of 1 Terabit, or 128 GB, so we're not seeing any new capacity increases ...
Автор: TheLostSwede
Источник: https://www.techpowerup.com/294827/micron-reveals-232-layer-nand-flash-during-investors-day