This week, South Korean semiconductor industry news outlets have mentioned an imminent unveiling of cutting-edge memory-making equipment at this month's Semicon Korea 2026 exhibition. This important t
rade event kicked off yesterday (February 11)—soon after start time, a Heraldcorp article appeared online; predicting Hanmi Semiconductor's presenting of a brand-new Wide TC Bonder. A photo of the com ...
Автор: T0@st
Источник: https://www.techpowerup.com/346307/hanmis-new-wide-tc-bonder-equipment-paves-way-for-hbm5-hbm6