Molex, a global electronics leader and connectivity innovator, has launched its Impress Co-Packaged Copper Solutions to meet the needs of next-generation data centers and AI workflows by delivering ul
tra-high-speed data transmission and exceptional signal integrity. Building on the proven on-substrate and near-ASIC expertise of Molex, Impress provides a compression-based, substrate connector and m ...
Автор: T0@st
Источник: https://www.techpowerup.com/346486/molex-launches-impress-co-packaged-copper-solutions-set-to-meet-next-gen-data-rate-demands