Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300 mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler f
or advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. "As AI workloads continue to increase package size, power density, and integration complexi ...
Автор: Nomad76
Источник: https://www.techpowerup.com/347249/wolfspeed-brings-300-mm-silicon-carbide-technology-to-next-gen-ai-data-center-packaging