(PR) Wolfspeed Brings 300 mm Silicon Carbide Technology to Next-Gen AI Data Center Packaging

10.03.2026 в 19:00,
Hard news

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300 mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler f

or advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. "As AI workloads continue to increase package size, power density, and integration complexi ...

Автор: Nomad76
Источник: https://www.techpowerup.com/347249/wolfspeed-brings-300-mm-silicon-carbide-technology-to-next-gen-ai-data-center-packaging
×