Intel Advanced Packaging Complex in Malaysia to Go Live Later This Year

Intel is accelerating its advanced packaging push with a major move in Malaysia. According to reports from The Edge Malaysia, the company's new complex there, part of Project Pelican, is now 99% compl

ete and set for full operations later this year. Malaysian Prime Minister Datuk Seri Anwar Ibrahim confirmed he met with Intel CEO Tan Lip-Bu and executives to review the project progress. The first p ...