SK hynix Turns to Intel’s EMIB Packaging as TSMC CoWoS Bottlenecks Squeeze the AI Supply Chain

As the race for the AI buildout continues to intensify, a shortage in the packaging industry has led memory manufacturer SK hynix to team up with Intel for chip packaging technology. After a strong co

meback under CEO Lip-Bu Tan, Intel is now aiming to expand its presence in the packaging industry. The firm and SK hynix are collaborating on 2.5D packaging technology and Intel's Embedded Multi-die I ...