TSMC’s AI Dominance Isn’t Under Threat By Intel Due To Key Raw Material Production, Says Citi

The Taiwan Semiconductor Manufacturing Company (TSMC) is unlikely to experience significant competitive pressures to its advanced packaging and chip manufacturing technologies, says a research report

from Citibank. In its coverage, the bank's analyst points out that the capacity for TSMC's advanced CoWoS packaging technology could grow significantly due to tailwinds from AI in 2026 and 2027, with  ...