(PR) Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level

Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip comp

onents to be fused almost seamlessly into a single unit. By precisely embedding small chiplets into specially structured silicon pockets, Fraunhofer IPMS succeeded in combining the advantages of a com ...