(PR) LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies at ECTC

LG Innotek (CEO Moon Hyuksoo) announced on May 27 that it will participate in the 2026 Electronic Components and Technology Conference (ECTC) to showcase its next-generation semiconductor package subs

trate technologies to global semiconductor companies. Now in its 76th year, ECTC is the world's largest international conference on semiconductor packaging technologies, organized by the Institute of  ...