Новости высоких технологий

19.03.2023 в 12:30,
Hard news

In February, during the 70th IEEE International Solid-State Circuits Conference (ISSCC), SK Hynix surprised attendees with details of the new eight-generation 3D NAND chips that incorporate over three

hundred active layers. The paper presented at the conference from SK Hynix, titled "High-Density Memories and High-Speed Interface," describes how the company will increase the performance of [… ...

Автор: wccftech.com
Источник: https://wccftech.com/sk-hynix-to-release-8th-generation-300-layer-3d-nand-chips-in-next-two-years/