SK Hynix To Release 8th Generation 300-Layer 3D NAND Chips In Next Two Years

In February, during the 70th IEEE International Solid-State Circuits Conference (ISSCC), SK Hynix surprised attendees with details of the new eight-generation 3D NAND chips that incorporate over three

hundred active layers. The paper presented at the conference from SK Hynix, titled "High-Density Memories and High-Speed Interface," describes how the company will increase the performance of [… ...