As energy demand grows in the data center segment, Intel is looking into new & innovative ways to cool next-gen chips with tech such as a 3D Vapor Chamber with up to 2000W of cooling potential. In
tel's 3D Vapor-Chamber Coolers For Next-Gen Chips Can Deliver Up To 2000W Cooling While Saving Lots of Electricity & […] Written by Hassan Mujtaba ...
Автор: wccftech.com
Источник: https://wccftech.com/intel-talks-future-cooling-solution-for-data-centers-3d-vapor-chambers-to-cool-up-to-2000w-next-gen-chips/