According to news out of Korea, NVIDIA is considering Samsung as a partner not only for HBM3 memory, but also as a potential partner when it comes to 2.5D chip packaging. The latter is due to TSMC hav
ing limited capacity when it comes to handling all of its customers advanced chip packaging needs, although Samsung is apparently not the only potential partner NVIDIA is looking at. Taiwan based SPIL ...
Автор: TheLostSwede
Источник: https://www.techpowerup.com/311475/nvidia-is-looking-at-samsung-for-hbm3-memory-and-2-5d-chip-packaging