NVIDIA Blackwell GB100 Die Could Use MCM Packaging

18.09.2023 в 18:33,
Hard news

NVIDIA's upcoming Blackwell GPU architecture, expected to succeed the current Ada Lovelace architecture, is gearing up to make some significant changes. While we don't have any microarchitectural leak

s, rumors are circulating that Blackwell will have different packaging and die structures. One of the most intriguing aspects of the upcoming Blackwell is the mention of a Multi-Chip Module (MCM) desi ...

Автор: AleksandarK
Источник: https://www.techpowerup.com/313755/nvidia-blackwell-gb100-die-could-use-mcm-packaging