Next-Gen Intel Chips Will Feature More Sand As Glass Is Set To Replace Organic Substrate Materials

18.09.2023 в 21:50,
Hard news

Intel has showcased its next-gen Glass Substrate packaging technology which will replace existing organic materials & offer higher interconnects. Next-Gen Chip Packaging From Intel Will Include Gl

ass Substrate, Bringing Significant […] Written by Muhammad Zuhair ...

Автор: wccftech.com
Источник: https://wccftech.com/next-gen-intel-chips-feature-more-sand-as-glass-set-to-replace-organic-substrate-materials/
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