Intel has showcased its next-gen Glass Substrate packaging technology which will replace existing organic materials & offer higher interconnects. Next-Gen Chip Packaging From Intel Will Include Gl
ass Substrate, Bringing Significant […] Written by Muhammad Zuhair ...
Автор: wccftech.com
Источник: https://wccftech.com/next-gen-intel-chips-feature-more-sand-as-glass-set-to-replace-organic-substrate-materials/