Pat Gelsinger Says 3D Stacked Cache Tech Coming to Intel

20.09.2023 в 05:39,
Hard news

Intel CEO Pat Gelsinger, in the Q&A session of InnovatiON 2023 Day 1, confirmed that the company is developing 3D-stacked cache technology for its processors. The technology involves expanding the

on-die last-level cache (L3 cache) of a processor with an additional SRAM die physically stacked on top, and bonded with the cache's high-bandwidth data fabric. The stacked cache operates at the same ...

Автор: btarunr