
Intel CEO Pat Gelsinger, in the Q&A session of InnovatiON 2023 Day 1, confirmed that the company is developing 3D-stacked cache technology for its processors. The technology involves expanding the
on-die last-level cache (L3 cache) of a processor with an additional SRAM die physically stacked on top, and bonded with the cache's high-bandwidth data fabric. The stacked cache operates at the same ...
Автор: btarunr
Источник: https://www.techpowerup.com/313818/pat-gelsinger-says-3d-stacked-cache-tech-coming-to-intel