Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Order

s For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readyin ...