Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

13.11.2023 в 16:10,
Hard news

Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Order

s For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readyin ...

Автор: wccftech.com
Источник: https://wccftech.com/samsungs-answer-tsmc-cowos-saint-advanced-interconnection-technology-next-gen-chips/
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