
Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Order
s For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readyin ...
Автор: wccftech.com
Источник: https://wccftech.com/samsungs-answer-tsmc-cowos-saint-advanced-interconnection-technology-next-gen-chips/