(PR) Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029: MarketsandMarkets Research

The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% during the for

ecast period according to a new report by MarketsandMarkets. The increasing demand for advanced packaging in AI and high-performance computing (HPC) are the key drivers fueling the expansion of the in ...