Last week SK Hynix revealed ambitious plans for its next wave of High Bandwidth Memory (HBM) products—their SEMICON Korea 2024 presentation included an announcement about cutting-edge HBM3E entering m
ass production within the first quarter of this year. True next-gen HBM development has already kicked off—TPU's previous report outlines an HBM4 sampling phase in 2025, followed by full production in ...
Автор: T0@st
Источник: https://www.techpowerup.com/318929/tsmc-sk-hynix-reportedly-form-strategic-ai-alliance-jointly-developing-hbm4