(PR) SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

03.04.2024 в 22:16,
Hard news

SK hynix Inc., the world's leading producer of High-Bandwidth Memory (HBM) chips, announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packagi

ng fabrication and R&D facility for AI products. The project, the first of its kind in the United States, is expected to drive innovation in the nation's AI supply chain, while bringing more than  ...

Автор: GFreeman
Источник: https://www.techpowerup.com/321163/sk-hynix-signs-investment-agreement-of-advanced-chip-packaging-with-indiana