TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company's 2024 North
America Technology Symposium. TSMC debuted the TSMC A16 technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improv ...
Автор: TheLostSwede
Источник: https://www.techpowerup.com/321875/tsmc-celebrates-30th-north-america-technology-symposium-with-innovations-powering-ai-with-silicon-leadership